FlipChip International, LLC
FlipChip International is the leading provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and five global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap™), Redistributed SFC , Wafer Ultra CSP™ , Spheron™ (High Frequency RF Packaging), Elite CSP™ (a low cost E-less Nickel bumping WLCSP), and Polymer Collar™ , Dicing , Optical Inspection , Pick-and-Place, Waffle-Pak, and Tape & Reel .
FlipChip provides turn-key wafer bumping services from engineering prototypes to high volume manufacturing.
Good Neighbor Partnership
FlipChip International LLC is proud to be a voluntary partner in the Phoenix Industry Challenge Good neighbor Partnership.
FlipChip International, LLC is committed to the protection of the environment and the health & safety of our employees, customers, contractors, suppliers and the communities where we work by striving to meet all applicable environment, health, safety laws, and regulations as required. We recognize that by integrating sound environment, health and safety management practices into all aspects of our business, we can offer technologically competitive products and services while conserving and enhancing resources for future generations.
To find out more abut us visit us at www.flipchip.com
